倒装芯片技能正在电子制造和包装行业中得到越来越多的应用，上海SMT贴片加工并且预计到下一个十年将以30-40％的速度增加。新材料系统的开发将使这种增加成为可能，前提是它们减少了制造时间并增加了牢靠性。

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